Bridge Technology
We have been able to significantly reduce the cost of thermal
imagers and increase their manufacturing scalability through three
principal developments, all of which ensure that the IRFPA can be
fabricated by mature, standard, high-volume, high-yield processes
available from numerous, worldwide suppliers.
The principal developments are:
- A patented, charge amplifier circuit technology, which is
capable of measuring extremely small electrical signals and is
insensitive to the high capacitance of thin film, ceramic,
pyroelectric sensing materials.
- Leveraging the commercial availability of high-output,
thin-film, high-operating temperature-range pyroelectric sensor
materials that were developed for non-thermal imaging applications.
Bridge independently developed the techniques for creating the
necessary sensor geometries on the sensor material.
- Patent applied for techniques for thermally insulating the
sensor material from the readout electronics while maintaining
an electrical connection and for fastening the sensor material
to the thermally insulating/electrical connection structure.